1. 2. 3. material content data sheet sales product name bsc109n10ns3 g issued 28. november 2014 ma# MA000836402 package pg-tdson-8-1 weight* 120.92 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.461 2.04 2.04 20352 20352 leadframe non noble metal iron 7439-89-6 0.038 0.03 313 inorganic material phosphorus 7723-14-0 0.011 0.01 94 non noble metal copper 7440-50-8 37.762 31.21 31.25 312296 312703 wire non noble metal copper 7440-50-8 0.057 0.05 0.05 470 470 encapsulation organic material carbon black 1333-86-4 0.083 0.07 690 plastics epoxy resin - 5.926 4.90 49006 inorganic material silicondioxide 60676-86-0 35.721 29.54 34.51 295418 345114 leadfinish non noble metal tin 7440-31-5 1.452 1.20 1.20 12005 12005 plating noble metal silver 7440-22-4 0.166 0.14 0.14 1369 1369 solder noble metal silver 7440-22-4 0.057 0.05 475 non noble metal tin 7440-31-5 0.046 0.04 380 non noble metal lead 7439-92-1 2.192 1.81 1.90 18131 18986 clip plating noble metal silver 7440-22-4 1.289 1.07 1.07 10664 10664 heatspreader non noble metal iron 7439-89-6 0.011 0.01 94 inorganic material phosphorus 7723-14-0 0.003 0.00 28 non noble metal copper 7440-50-8 11.320 9.36 9.37 93619 93741 heat sink clip non noble metal iron 7439-89-6 0.022 0.02 185 inorganic material phosphorus 7723-14-0 0.007 0.01 55 non noble metal copper 7440-50-8 22.292 18.44 18.47 184356 184596 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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